22 Jul , 2026 By : Debdeep Gupta
Shares of Paras Defence & Space Technologies traded lower in early trade on Wednesday even after the company announced plans to invest around Rs 6,200 crore in a greenfield semiconductor packaging facility in Madhya Pradesh.
At 9:29 am, the stock of Paras Defence was down 1.10% on the NSE.
The company said its subsidiary, Paras Semiconductors Pvt Ltd, has signed a memorandum of understanding (MoU) with the Madhya Pradesh State Electronics Development Corporation (MPSeDC) to establish an Outsourced Semiconductor Assembly and Test (OSAT) facility in the Indore-Ujjain region.
"Paras Semiconductors will set up a greenfield advanced IC packaging OSAT facility in Indore-Ujjain, Madhya Pradesh, with a proposed investment of approx. Rs. 6,200 Crores," the company said in an exchange filing.
The proposed facility will undertake advanced semiconductor packaging operations, including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability.
The company said the project will be developed in collaboration with MPSeDC by leveraging the expertise and resources of both entities. The investment is expected to support India's efforts to build domestic semiconductor packaging and testing capabilities under the India Semiconductor Mission.
The announcement comes days after the Union Cabinet approved the Rs 1.27 lakh crore India Semiconductor Mission (ISM 2.0), a six-year programme aimed at deepening the country's semiconductor ecosystem. The revamped scheme focuses on supporting the broader chip supply chain while offering capital incentives of up to 40% for semiconductor fabrication plants and 35% for advanced packaging facilities.
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